| PART |
Description |
Maker |
| 408-8737 |
The die assembly consists of an indenter die and nest die. Each die is held in the tool by a single screw
|
Tyco Electronics
|
| IRG4CC81KB IRG4CC40RB |
TRANSISTOR | IGBT | N-CHAN | 600V V(BR)CES | CHIP 晶体管| IGBT的|正陈| 600V的五（巴西）国际消费电子展|芯片
IRG4CC81KB IGBT Die in Wafer Form
|
International Rectifier
|
| 5SMX12M3300 |
IGBT-Die
|
ABB Semiconductors
The ABB Group
|
| 5SMX12K1701 |
IGBT-Die
N/A
|
The ABB Group
ABB Semiconductors
|
| DD750S65K3 |
Bare Die IGBT
|
Infineon Technologies AG
|
| IRG4CH40SB |
IRG4CH40SB IGBT Die in Wafer Form
|
IRF[International Rectifier]
|
| IRG4CH30KB |
IRG4CH30KB IGBT Die in Wafer Form
|
International Rectifier
|
| IRG4CC60UB |
IRG4CC60UB IGBT Die in Wafer Form
|
International Rectifier
|
| IRG4CC70UB |
IRG4CC70UB IGBT Die in Wafer Form
|
International Rectifier
|
| IRG4CC88KB |
IRG4CC88KB IGBT Die in Wafer Form
|
International Rectifier
|
| IRG4CC10KB |
IRG4CC10KB IGBT Die in Wafer Form
|
International Rectifier
|
